UL for Printed Wiring Boards
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UL's iQ for Printed Wiring Boards includes materials covered under the following categories

Component - Printed Wiring Boards (ZPMV2)
This category covers printed wiring boards for use as components in devices or appliances. The boards may use organic or inorganic base materials in a single or multilayer, rigid or flexible form. Circuitry construction may include etched, die stamped, precut, flush press, additive, and plated conductor techniques. Printed-component parts may be used.
Component - Laminates (QMTS2)
This category covers materials that have been tested in accordance with established methods to define their properties in order to facilitate investigation of their use in end-product applications. These materials may consist of filament-wound tubing, industrial laminates, vulcanized fiber, and other materials for use in fabricating Recognized printed wiring boards.
Component - Flexible Printed Wiring Boards (ZPXK2)
This category covers printed wiring construction incorporating flexible materials for use as components in devices or appliances. Flexible materials are defined as films or materials exhibiting flexible properties. The constructions may use flexible materials in a single or multilayer build-up and in combination with additional flexible or rigid materials. Flexible material constructions may employ etched, die stamped, precut, flush-press, additive plated conductors, polymer thick film, dual access, cast and adhesiveless techniques. Printed-component parts may be used.
Component - Coatings for use on Printed Wiring Boards (QMJU2)
This category covers permanent coatings for use on Recognized printed wiring boards. These coatings may consist of solder resists (solder masks) or conformal coatings.

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