UL Certification: E103670 - Materials for Use in Fabricating Recognized Printed Wiring Boards

Materials for Use in Fabricating Recognized Printed Wiring Boards		E103670
Guide Information
DOOSAN CORPORATION ELECTRO-MATERIALS BG
R & D CENTER 39-3 SUNGBOK-DONG, YONGIN-SI Gyeonggi-do 449-795 KR
DS-7402, DS-7402M, DS-7402D, DS-7402LC
Metal clad industrial laminates for use in multilayer printed wiring boards with copper on one or both sides furnished as sheets

Unclad Dsg	Prepreg Dsg	ANSI Type	Min Build Up Thk(mm)	Min Cond Ext(mic)	Max Cond Ext(mic)	Max Cond Int(mic)	Max Area Diam(mm)	Max Oper Temp(°C)	Flame Class	Assembly Solder Process Temp(°C)	Assembly Solder Process Cycles	Solder Temp(°C)	Solder Time(sec)
DS-7402, DS-7402M, DS-7402D, DS-7402LC	DS-7402-BS, DS-7402M-BS, DS-7402D-BS, DS-7402LC-BS	FR-4.1	0.38	17.5	102	68	50.8	130	V-0	-	-	288	60

Unclad
Dsg

Prepreg
Dsg

ANSI
Type

Min Build Up
Thk(mm)

Min Cond
Ext(mic)

Max Cond
Ext(mic)

Max Cond
Int(mic)

Max Area
Diam(mm)

Max Oper
Temp(°C)

Flame
Class

Assembly Solder Process
Temp(°C)

Assembly Solder Process
Cycles

Solder
Temp(°C)

Solder
Time(sec)

DS-7402, DS-7402M, DS-7402D, DS-7402LC

DS-7402-BS, DS-7402M-BS, DS-7402D-BS, DS-7402LC-BS

FR-4.1

0.38

17.5

102

50.8

130

V-0

288

Report Date:	1986-08-07	© 2026 UL Solutions
Last Revised:	2020-04-20

IEC and ISO Test Methods
Test Name	Test Method	Units	Thk (mm)	Value
Flammability	IEC 60695-11-10	Class (color)	0.38	V-0
IEC Comparative Tracking Index	IEC 60112	Volts (Max)	-	-

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