Materials for Use in Fabricating Recognized Printed Wiring Boards
E98983
Guide Information
NAN YA PLASTICS CORP CCL DEPT ELECTRONIC MATERIAL DIV
6F A1 Bldg No. 390 Sec 6 Nanjing E Rd Neihu District, TAIPEI 11470 TW
NP-175FR, NP-175FTL, NP-155FR, NP-155FTL, NP-180FR, NP-180FTL, NP-175FMR, NP-175FMTL, NP-155FMR, NP-155FMTL, NP-175FBH, NP-155FBH, NP-155F(C)R, NP-155F(C)TL (ASP 1)
Metal clad industrial laminates for use in single layer printed wiring boards with copper on one or both sides furnished as sheets
Unclad
Dsg
Prepreg
Dsg
ANSI
Type
Min Build Up
Thk(mm)
Min Cond
Ext(mic)
Max Cond
Ext(mic)
Max Cond
Int(mic)
Max Area
Diam(mm)
Max Oper
Temp(°C)
Flame
Class
Assembly Solder Process
Temp(°C)
Assembly Solder Process
Cycles
Solder
Temp(°C)
Solder
Time(sec)
NP-175FR, NP-175FTL, NP-155FR, NP-155FTL, NP-180FR, NP-180FTL, NP-175FMR, NP-175FMTL, NP-155FMR, NP-155FMTL, NP-175FBH, NP-155FBH, NP-155F(C)R, NP-155F(C)TL
-
FR-4.0
0.20
9
102
-
50.8
130
V-0
-
-
300
30
0.25
9
102
-
50.8
130
V-0
260
6
300
30
(ASP 1) -
Assembly solder process evaluated to IPC-TM-650, 2.6.27 Thermal Stress Assembly Simulation.
Report Date:
2022-05-30
© 2026 UL Solutions
Last Revised:
2025-05-22
IEC and ISO Test Methods
Test Name
Test Method
Units
Thk (mm)
Value
Flammability
IEC 60695-11-10
Class (color)
0.20
V-0
0.25
V-0
IEC Comparative Tracking Index
IEC 60112
Volts (Max)
-
-
Tradenames/Trademarks for File E98983:
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