Materials for Use in Fabricating Recognized Printed Wiring Boards		E98983
Guide Information
NAN YA PLASTICS CORP CCL DEPT ELECTRONIC MATERIAL DIV
6F A1 Bldg No. 390 Sec 6 Nanjing E Rd Neihu District, TAIPEI 11470 TW
NP-175FR, NP-175FTL, NP-155FR, NP-155FTL, NP-180FR, NP-180FTL, NP-175FMR, NP-175FMTL, NP-155FMR, NP-155FMTL, NP-175FBH, NP-155FBH, NP-155F(C)R, NP-155F(C)TL (ASP 1)
Metal clad industrial laminates for use in multilayer printed wiring boards with copper on one or both sides furnished as sheets

Unclad Dsg	Prepreg Dsg	ANSI Type	Min Build Up Thk(mm)	Min Cond Ext(mic)	Max Cond Ext(mic)	Max Cond Int(mic)	Max Area Diam(mm)	Max Oper Temp(°C)	Flame Class	Assembly Solder Process Temp(°C)	Assembly Solder Process Cycles	Solder Temp(°C)	Solder Time(sec)
NP-175FR, NP-175FTL, NP-155FR, NP-155FTL, NP-180FR, NP-180FTL, NP-175FMR, NP-175FMTL,NP-155FMR, NP-155FMTL, NP-175FBH, NP-155FBH, NP-155F(C)R, NP-155F(C)TL	NP-175FB, NP-155FB, NP-180FB, NP-175FMB, NP-155FMB, NP-175FBHB, NP-155FBHB, NP-155F(C)B	FR-4.0	0.20	9	102	102	50.8	130	V-0	-	-	300	30
			0.25	9	102	102	50.8	130	V-0	260	6	300	30
			0.38	9	102	210	50.8	130	V-0	260	6	300	30

(ASP 1) -

Assembly solder process evaluated to IPC-TM-650, 2.6.27 Thermal Stress Assembly Simulation.

Report Date:	2022-05-30	© 2025 UL Solutions
Last Revised:	2025-05-22

 

IEC and ISO Test Methods
Test Name	Test Method	Units	Thk (mm)	Value
Flammability	IEC 60695-11-10	Class (color)	0.20	V-0
			0.25	V-0
			0.38	V-0
IEC Comparative Tracking Index	IEC 60112	Volts (Max)	-	-

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