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Materials for Use in Fabricating Recognized Printed Wiring BoardsE81336
Guide Information
Panasonic Industry Co., Ltd.
Koriyama Factory, 111 Aza-Ishizuka, Koriyama-Shi Fukushima 963-8556 JP
R-5761a(%4), R-5766a(%4)
Ultrathin industrial laminates and bonding layers, furnished in sheet form, for use in multilayer printed wiring boards where the thickness is built up to the minimum specified
ANSI
Type
Min Build Up
Thk(mm)
RTI Elec
(°C)
RTI Mech
(°C)
Laminate
Mtl Dsg
Laminate
Sheet Thk(mic)
Laminate RTI
Elec(°C)
Prepreg
Mtl Dsg
Prepreg Sheet
Thk(mic)
Prepreg RTI
Elec(°C)
No ANSI0.20120130R-5621a(%4)50110R-166150110
0.20120130R-5621a(%4)100120R-1661100120
0.38130130R-5621a(%4)50110R-166150110
0.38130130R-5621a(%4)100120R-1661100120
(%4) - Limited to a maximum build-up thickness of 0.80 mm.
Report Date:1982-03-04© 2025 UL Solutions
Last Revised:2012-02-07
 
IEC and ISO Test Methods
Test NameTest MethodUnitsThk (mm)Value
FlammabilityIEC 60695-11-10Class (color)--
IEC Comparative Tracking IndexIEC 60112Volts (Max)--
Tradenames/Trademarks for File E81336: , ,