Materials for Use in Fabricating Recognized Printed Wiring BoardsE81336
Guide Information
Panasonic Industry Co., Ltd.
Koriyama Factory, 111 Aza-Ishizuka, Koriyama-Shi Fukushima 963-8556 JP
R-8700, R-8705
Metal clad industrial laminates for use in single layer printed wiring boards with copper on one or both sides furnished as sheets
Unclad
Dsg
Prepreg
Dsg
ANSI
Type
Min Build Up
Thk(mm)
Min Cond
Ext(mic)
Max Cond
Ext(mic)
Max Cond
Int(mic)
Max Area
Diam(mm)
Max Oper
Temp(°C)
Flame
Class
Assembly Solder Process
Temp(°C)
Assembly Solder Process
Cycles
Solder
Temp(°C)
Solder
Time(sec)
R-8100-FR-10.7117103-25.4100V-0----
0.7134103-50.8105V-0--180
230
260
23
260
10800
80
10
300
10
0.7134103-25.4130V-0--180
230
260
23
260
10800
80
10
300
10
1.4534103-50.8105V-0--27412
1.4534103-50.8105V-0--2886
Report Date:1982-03-08© 2026 UL Solutions
Last Revised:2021-04-13
 
IEC and ISO Test Methods
Test NameTest MethodUnitsThk (mm)Value
FlammabilityIEC 60695-11-10Class (color)0.71V-0
0.71V-0
0.71V-0
1.45V-0
1.45V-0
IEC Comparative Tracking IndexIEC 60112Volts (Max)--
Tradenames/Trademarks for File E81336: , ,