Materials for Use in Fabricating Recognized Printed Wiring Boards		E81340
Guide Information
MITSUBISHI GAS CHEMICAL CO, INC. ELECTRONICS MATERIALS DIV
2-5-2 Marunouchi, Chiyodaku-Ku, Tokyo Tokyo 100-8324 JP
CCL-E190T, CCL-EL190T, CCL-C190T, CCL-CL190T,CCL-E190T-M, CCL-EL190T-M, CCL-C190T-M, CCL-CL190T-M
Metal clad industrial laminates for use in single layer printed wiring boards with copper on one or both sides furnished as sheets

Unclad Dsg

Prepreg Dsg

ANSI Type

Min Build Up Thk(mm)

Min Cond Ext(mic)

Max Cond Ext(mic)

Max Cond Int(mic)

Max Area Diam(mm)

Max Oper Temp(°C)

Flame Class

Assembly Solder Process Temp(°C)

Assembly Solder Process Cycles

Solder Temp(°C)

Solder Time(sec)

GEP-190T, GEL-190T, GCP-190T, GCL-190T, GEP-190T-M, GEL-190T-M, GCP-190T-M, GCL-190T-M

-

FR-4.0

0.05

8.5

102

-

50.8

130

V-0

-

-

290

120

Report Date:	1991-04-19	© 2026 UL Solutions
Last Revised:	2014-02-06

 

IEC and ISO Test Methods
Test Name	Test Method	Units	Thk (mm)	Value
Flammability	IEC 60695-11-10	Class (color)	0.05	V-0
IEC Comparative Tracking Index	IEC 60112	Volts (Max)	-	-

Tradenames/Trademarks for File E81340: