UL Certification: E123995 - Materials for Use in Fabricating Recognized Printed Wiring Boards

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Materials for Use in Fabricating Recognized Printed Wiring Boards		E123995
Guide Information
KINGBOARD LAMINATES HOLDINGS LTD
23/F., Delta House, No. 3 On Yiu Street, Shatin HK
KB-6167F
Metal clad industrial laminates for use in multilayer printed wiring boards with copper on one or both sides furnished as sheets

Unclad Dsg	Prepreg Dsg	ANSI Type	Min Build Up Thk(mm)	Min Cond Ext(mic)	Max Cond Ext(mic)	Max Cond Int(mic)	Max Area Diam(mm)	Max Oper Temp(°C)	Flame Class	Assembly Solder Process Temp(°C)	Assembly Solder Process Cycles	Solder Temp(°C)	Solder Time(sec)
KB-6167F	KB-6067F	FR-4.0	0.38	12	102	102	50.8	130	V-0	-	-	288	60

Unclad
Dsg

Prepreg
Dsg

ANSI
Type

Min Build Up
Thk(mm)

Min Cond
Ext(mic)

Max Cond
Ext(mic)

Max Cond
Int(mic)

Max Area
Diam(mm)

Max Oper
Temp(°C)

Flame
Class

Assembly Solder Process
Temp(°C)

Assembly Solder Process
Cycles

Solder
Temp(°C)

Solder
Time(sec)

KB-6167F

KB-6067F

FR-4.0

0.38

102

50.8

130

V-0

288

Report Date:	1990-08-01	© 2025 UL Solutions
Last Revised:	2013-12-17

IEC and ISO Test Methods
Test Name	Test Method	Units	Thk (mm)	Value
Flammability	IEC 60695-11-10	Class (color)	0.38	V-0
IEC Comparative Tracking Index	IEC 60112	Volts (Max)	-	-