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Materials for Use in Fabricating Recognized Printed Wiring Boards
E81340
Guide Information
MITSUBISHI GAS CHEMICAL CO, INC. ELECTRONICS MATERIALS DIV
2-5-2 Marunouchi, Chiyodaku-Ku, Tokyo Tokyo 100-8324 JP
CCL-H832NS or CCL-HL832NS /GHPL-830NS (&)
Ultrathin industrial laminates and bonding layers, furnished in sheet form, for use in multilayer printed wiring boards where the thickness is built up to the minimum specified
ANSI
Type
Min Build Up
Thk(mm)
RTI Elec
(°C)
RTI Mech
(°C)
Laminate
Mtl Dsg
Laminate
Sheet Thk(mic)
Laminate RTI
Elec(°C)
Prepreg
Mtl Dsg
Prepreg Sheet
Thk(mic)
Prepreg RTI
Elec(°C)
No ANSI
0.08
105
140
GHP-832NS, GHL-832NS
30
105
GHPL-830NS
25
50
0.38
140
160
GHP-832NS, GHL-832NS
30
105
GHPL-830NS
25
50
0.80
160
170
GHP-832NS, GHL-832NS
30
105
GHPL-830NS
25
50
& -
Grade limited to a maximum thickness of 0.80 mm
Report Date:
1991-04-18
© 2025 UL Solutions
Last Revised:
2013-09-30
IEC and ISO Test Methods
Test Name
Test Method
Units
Thk (mm)
Value
Flammability
IEC 60695-11-10
Class (color)
-
-
IEC Comparative Tracking Index
IEC 60112
Volts (Max)
-
-
Tradenames/Trademarks for File E81340: