Wiring, Printed - Component		E363709
Guide Information
SHENZHEN HEHEXIN ELECTRONIC TECHNOLOGY CO LTD
3F, Building A6, Pengjin Industrial Area, North of Yanchuan Industrial Zone, Yanluo Street, Songgang Town, Bao'An District, Shenzhen Guangdong CN
Type dsg: HHX-M
Multilayer printed wiring boards

Cond Width Min (mm)

Cond Width Edge (mm)

Cond Thk Min (mic)

Cond Thk Max Int (mic)

Cond Thk Max Ext (mic)

SS/ DS/ DSO

Max Area Diam (mm)

Report Date After 2022-01-01

Surface Mount Technology

Assembly Solder Process Temp(°C)

Assembly Solder Process Cycles

Solder Limits Temp (°C)

Solder Limits Time (sec)

Max Oper Temp (°C)

Flame Class

Meets UL796 DSR

CTI

0.1

0.1

17

34

102

DS

50.8

No

-

-

-

288

20

130

V-0

All

3

Report Date:	2014-05-06	© 2026 UL Solutions
Last Revised:	2017-07-11