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Materials for Use in Fabricating Recognized Printed Wiring Boards
E136069
Guide Information
Zhejiang Wazam New Materials Co Ltd
HUAYI RD, NO 2 YUHANG STREET, HANGZHOU Zhejiang 311121 CN
HSD6LG, HSD7LG, HMW30, HSD7LG(K), HSD8LG, HSD9LG
Metal clad industrial laminates for use in single layer printed wiring boards with copper on one or both sides furnished as sheets
Unclad
Dsg
Prepreg
Dsg
ANSI
Type
Min Build Up
Thk(mm)
Min Cond
Ext(mic)
Max Cond
Ext(mic)
Max Cond
Int(mic)
Max Area
Diam(mm)
Max Oper
Temp(°C)
Flame
Class
Assembly Solder Process
Temp(°C)
Assembly Solder Process
Cycles
Solder
Temp(°C)
Solder
Time(sec)
HSD6LG, HSD7LG, HMW30, HSD7LG(K), HSD8LG, HSD9LG
-
No ANSI
0.05
12
102
-
50.8
105
V-0
-
-
288
20
0.10
12
102
-
50.8
110
V-0
-
-
288
20
0.20
12
102
-
50.8
120
V-0
-
-
288
20
0.38
12
102
-
50.8
130
V-0
-
-
288
20
Report Date:
1991-06-07
© 2026 UL Solutions
Last Revised:
2025-01-07
IEC and ISO Test Methods
Test Name
Test Method
Units
Thk (mm)
Value
Flammability
IEC 60695-11-10
Class (color)
0.05
V-0
0.10
V-0
0.20
V-0
0.38
V-0
IEC Comparative Tracking Index
IEC 60112
Volts (Max)
-
-
Tradenames/Trademarks for File E136069:
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