Wiring, Printed - Component		E347973
Guide Information
HUADING GROUP CO LTD
12/F, Nanfung Centre, 264-298 Castle Peak Rd, Tsuen Wan HK
Type dsg: HD-M02
Multilayer printed wiring boards

Cond Width Min (mm)

Cond Width Edge (mm)

Cond Thk Min (mic)

Cond Thk Max Int (mic)

Cond Thk Max Ext (mic)

SS/ DS/ DSO

Max Area Diam (mm)

Report Date After 2022-01-01

Surface Mount Technology

Assembly Solder Process Temp(°C)

Assembly Solder Process Cycles

Solder Limits Temp (°C)

Solder Limits Time (sec)

Max Oper Temp (°C)

Flame Class

Meets UL796 DSR

CTI

0.1

0.3

17

24

102

DS

25

No

-

-

-

250

10

130

V-0

All

*

* -	CTI rating may be marked on individual boards.

Report Date:	2021-09-09	© 2026 UL Solutions
Last Revised:	2021-09-09

 

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