Wiring, Printed - Component		E347973
Guide Information
HUADING GROUP CO LTD
12/F, Nanfung Centre, 264-298 Castle Peak Rd, Tsuen Wan HK
Type dsg: HD-D08 (ASP 1)
Single layer printed wiring boards

Cond Width Min (mm)

Cond Width Edge (mm)

Cond Thk Min (mic)

Cond Thk Max Int (mic)

Cond Thk Max Ext (mic)

SS/ DS/ DSO

Max Area Diam (mm)

Report Date After 2022-01-01

Surface Mount Technology

Assembly Solder Process Temp(°C)

Assembly Solder Process Cycles

Solder Limits Temp (°C)

Solder Limits Time (sec)

Max Oper Temp (°C)

Flame Class

Meets UL796 DSR

CTI

0.1

0.1

18

-

102

DS

25.4

Yes

Yes

260

3

-

-

130

V-0

All

*

(ASP 1) -	Assembly solder process evaluated to IPC-TM-650, 2.6.27 Thermal Stress Assembly Simulation.
* -	CTI rating may be marked on individual boards.

Report Date:	2022-07-19	© 2026 UL Solutions
Last Revised:	2024-01-11

 

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