Wiring, Printed - Component		E347973
Guide Information
HUADING GROUP CO LTD
12/F, Nanfung Centre, 264-298 Castle Peak Rd, Tsuen Wan HK
Type dsg: HD-M13 (ASP 1)
Multilayer printed wiring boards

Cond Width Min (mm)

Cond Width Edge (mm)

Cond Thk Min (mic)

Cond Thk Max Int (mic)

Cond Thk Max Ext (mic)

SS/ DS/ DSO

Max Area Diam (mm)

Report Date After 2022-01-01

Surface Mount Technology

Assembly Solder Process Temp(°C)

Assembly Solder Process Cycles

Solder Limits Temp (°C)

Solder Limits Time (sec)

Max Oper Temp (°C)

Flame Class

Meets UL796 DSR

CTI

0.1

0.1

18

70

102

DS

25.4

Yes

Yes

260

3

-

-

130

V-0

All

*

(ASP 1) -	Assembly solder process evaluated to IPC-TM-650, 2.6.27 Thermal Stress Assembly Simulation.
* -	CTI rating may be marked on individual boards.

Report Date:	2022-07-18	© 2026 UL Solutions
Last Revised:	2024-01-11

 

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