iq.ul.com
Materials for Use in Fabricating Recognized Printed Wiring BoardsE81336
Guide Information
Panasonic Industry Co., Ltd.
Koriyama Factory, 111 Aza-Ishizuka, Koriyama-Shi Fukushima 963-8556 JP
R-578Y (Note 6) (Note 15) (Note 23)
Metal clad industrial laminates for use in single layer printed wiring boards with copper on one or both sides furnished as sheets or rolls
Unclad
Dsg
Prepreg
Dsg
ANSI
Type
Min Build Up
Thk(mm)
Min Cond
Ext(mic)
Max Cond
Ext(mic)
Max Cond
Int(mic)
Max Area
Diam(mm)
Max Oper
Temp(°C)
Flame
Class
Assembly Solder Process
Temp(°C)
Assembly Solder Process
Cycles
Solder
Temp(°C)
Solder
Time(sec)
R-578Y-No ANSI0.055102-50.8115V-0--180
200
230
260
25
288
10800
2400
180
40
300
50
0.105102-50.8130V-0--180
200
230
260
25
288
10800
2400
180
40
300
50
0.205102-50.8130V-0--180
200
230
260
25
288
10800
2400
180
40
300
50
0.405102-50.8130V-0--180
200
230
260
25
288
10800
2400
180
40
300
50
0.505102-50.8130V-0--180
200
230
260
25
288
10800
2400
180
40
300
50
(Note 6) - Alphanumeric suffix of GE, GN, N, GT, GL or PLUS to denote glass type and supplier
Note 15 - Industrial Laminate furnished as sheets or rolls is marketed as Megtron 7
Note 23 - 20 micron laminate sheet thickness and prepreg sheet thickness is only associated with E-Glass
Report Date:2024-03-28© 2025 UL Solutions
Last Revised:2025-03-25
 
IEC and ISO Test Methods
Test NameTest MethodUnitsThk (mm)Value
FlammabilityIEC 60695-11-10Class (color)0.05V-0
0.10V-0
0.20V-0
0.40V-0
0.50V-0
IEC Comparative Tracking IndexIEC 60112Volts (Max)--
Tradenames/Trademarks for File E81336: , ,