UL Certification: E521933 - Wiring, Printed

Wiring, Printed - Component		E521933
Guide Information
Toptek PCB Co Ltd
A417, Building 1, Hedong Industrial Zone, Xin'an Street, Bao'an 49 District, Shenzhen Guangdong 518101 CN
Type dsg: TTP-8 (ASP 1)
Multilayer printed wiring boards

Cond Width Min (mm)	Cond Width Edge (mm)	Cond Thk Min (mic)	Cond Thk Max Int (mic)	Cond Thk Max Ext (mic)	SS/ DS/ DSO	Max Area Diam (mm)	Report Date After 2022-01-01	Surface Mount Technology	Assembly Solder Process Temp(°C)	Assembly Solder Process Cycles	Solder Limits Temp (°C)	Solder Limits Time (sec)	Max Oper Temp (°C)	Flame Class	Meets UL796 DSR	CTI
0.075	0.075	12	102	102	DS	76.2	Yes	Yes	260	4	288	20	130	V-0	All	*

Cond
Width
Min
(mm)

Cond
Width
Edge
(mm)

Cond
Thk
Min
(mic)

Cond
Thk
Max Int
(mic)

Cond
Thk
Max Ext
(mic)

SS/
DS/
DSO

Max
Area
Diam
(mm)

Report
Date
After
2022-01-01

Surface
Mount
Technology

Assembly
Solder
Process
Temp(°C)

Assembly
Solder
Process
Cycles

Solder
Limits
Temp
(°C)

Solder
Limits
Time
(sec)

Max
Oper
Temp
(°C)

Flame
Class

Meets
UL796
DSR

CTI

0.075

102

76.2

Yes

260

288

130

V-0

All

(ASP 1) -	Assembly Solder process evaluated to IPC-TM-650, 2.6.27 Thermal Stress Assembly Simulation.
* -	CTI rating may be marked on individual boards.

Report Date:	2025-03-25	© 2026 UL Solutions
Last Revised:	2025-03-25